METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND CONNECTOR

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, capable of manufacturing a semiconductor device which has high reliability without forming any void in a soldering process.SOLUTION: There is provided a method of manufacturing a semiconductor device characterized in...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUZUKI RYOKEI, WATABE MASAYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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