MANUFACTURING METHOD OF PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND ATOMIC CLOCK
PROBLEM TO BE SOLVED: To provide a manufacturing method of a package which prevents the inclination of a metal pin during forming a through electrode.SOLUTION: A through electrode formation process includes: (a) a through hole formation process where through holes 21, 22 are formed for disposing thr...
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| creator | FUNABIKI YOICHI |
| description | PROBLEM TO BE SOLVED: To provide a manufacturing method of a package which prevents the inclination of a metal pin during forming a through electrode.SOLUTION: A through electrode formation process includes: (a) a through hole formation process where through holes 21, 22 are formed for disposing through electrodes on a wafer 40 for a base substrate; (b) a metal pin arrangement process where a core material part 31 of a metal pin 30 is inserted into each of the through holes 21, 22; (c) a film formation process where a silicone oxide film 36, having larger wettability with a glass frit than that of the metal pin 30, is formed on an outer peripheral surface of the core material part 31 and an inner peripheral surface of the through hole 21, 22; a filling process where the glass frit fills a space between the through hole 21, 22 and the core material part 31; and a heat hardening process where the glass flit filling the through hole 21, 22 is heated and hardened. |
| format | Patent |
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(b) a metal pin arrangement process where a core material part 31 of a metal pin 30 is inserted into each of the through holes 21, 22; (c) a film formation process where a silicone oxide film 36, having larger wettability with a glass frit than that of the metal pin 30, is formed on an outer peripheral surface of the core material part 31 and an inner peripheral surface of the through hole 21, 22; a filling process where the glass frit fills a space between the through hole 21, 22 and the core material part 31; and a heat hardening process where the glass flit filling the through hole 21, 22 is heated and hardened.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BASIC ELECTRONIC CIRCUITRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION OF NOISE BY SUCH CIRCUITS ; GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER ; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS ; 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| subjects | BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION OF NOISE BY SUCH CIRCUITS GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES |
| title | MANUFACTURING METHOD OF PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND ATOMIC CLOCK |
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