SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a sensor package having a simple wiring structure to prevent an increase in chip size and a method for manufacturing the sensor package.SOLUTION: The method for manufacturing the sensor package includes the processes of: forming a sensor including a fixed portion, a...

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Bibliographische Detailangaben

1. Verfasser:	MORII AKIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MEASURING MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK PHYSICS SEMICONDUCTOR DEVICES TESTING
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