WIRING BODY WITH WIRING SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a wiring body with a wiring sheet, a semiconductor device, and a method for manufacturing the semiconductor device which can simplify a manufacturing process.SOLUTION: In a semiconductor device 1 including a switching element 10 having a source electrode 14 and a gat...
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| creator | ARIYOSHI TAKESHI SAITO HIROHISA UENISHI NAOTA |
| description | PROBLEM TO BE SOLVED: To provide a wiring body with a wiring sheet, a semiconductor device, and a method for manufacturing the semiconductor device which can simplify a manufacturing process.SOLUTION: In a semiconductor device 1 including a switching element 10 having a source electrode 14 and a gate electrode 15 formed on a first main surface 11 and a drain electrode 13 formed on a second main surface 12, and a conductive layer stacked substrate 80 connected to the drain electrode 13, a wiring body 30 with a wiring sheet is used as an upper-side wiring structure. The wiring body 30 with the wiring sheet includes a wiring body 40 connected to the source electrode 14, and a wiring sheet 60 provided with a gate terminal connected to the gate electrode 15. The wiring sheet 60 is stuck to an outer surface 41B of the wiring body 40. At least tip portion 60C out of the wiring sheet 60 has flexibility, and a terminal portion 62B including the gate terminal out of the tip portion 60C projects outside from the wiring body 40. |
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The wiring body 30 with the wiring sheet includes a wiring body 40 connected to the source electrode 14, and a wiring sheet 60 provided with a gate terminal connected to the gate electrode 15. The wiring sheet 60 is stuck to an outer surface 41B of the wiring body 40. 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The wiring body 30 with the wiring sheet includes a wiring body 40 connected to the source electrode 14, and a wiring sheet 60 provided with a gate terminal connected to the gate electrode 15. The wiring sheet 60 is stuck to an outer surface 41B of the wiring body 40. At least tip portion 60C out of the wiring sheet 60 has flexibility, and a terminal portion 62B including the gate terminal out of the tip portion 60C projects outside from the wiring body 40.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | WIRING BODY WITH WIRING SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
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