SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor device which allows wires to be connected stably in a less connection area on a slanted part, on a via and on a via cover, which are considered as an unavailable area for wire bonding.SOLUTION: A semiconductor device comprises: a package including an...
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| creator | OHIRO MASAHIKO FUJII EIZO TAKAYAMA YOSHIKI |
| description | PROBLEM TO BE SOLVED: To provide a semiconductor device which allows wires to be connected stably in a less connection area on a slanted part, on a via and on a via cover, which are considered as an unavailable area for wire bonding.SOLUTION: A semiconductor device comprises: a package including an opening, a die pad provided in the opening, a slanted part provided around the opening and an inner lead; a semiconductor chip including a first electrode pad and mounted on the die pad; and a first wire connecting the inner lead and the first electrode pad. At least a part of the inner lead is arranged on the slanted part and a first component on which the first wire is connected is arranged on the inner lead. |
| format | Patent |
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At least a part of the inner lead is arranged on the slanted part and a first component on which the first wire is connected is arranged on the inner lead.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130520&DB=EPODOC&CC=JP&NR=2013098357A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130520&DB=EPODOC&CC=JP&NR=2013098357A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OHIRO MASAHIKO</creatorcontrib><creatorcontrib>FUJII EIZO</creatorcontrib><creatorcontrib>TAKAYAMA YOSHIKI</creatorcontrib><title>SEMICONDUCTOR DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a semiconductor device which allows wires to be connected stably in a less connection area on a slanted part, on a via and on a via cover, which are considered as an unavailable area for wire bonding.SOLUTION: A semiconductor device comprises: a package including an opening, a die pad provided in the opening, a slanted part provided around the opening and an inner lead; a semiconductor chip including a first electrode pad and mounted on the die pad; and a first wire connecting the inner lead and the first electrode pad. 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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR DEVICE |
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