COOLER
PROBLEM TO BE SOLVED: To provide a cooler capable of having equal cooling capability on both surfaces of a tube while suppressing an increase in build.SOLUTION: The cooler includes at least one tube that has a medium passage where a refrigerant flows inside, both one surface and the reverse surface...
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| creator | SUGIURA SHUN IDE SHIGEO |
| description | PROBLEM TO BE SOLVED: To provide a cooler capable of having equal cooling capability on both surfaces of a tube while suppressing an increase in build.SOLUTION: The cooler includes at least one tube that has a medium passage where a refrigerant flows inside, both one surface and the reverse surface opposite from the one surface being cooling surfaces for cooling electronic components, and a refrigerant intake of the refrigerant passage being provided on the one surface side. The refrigerant intake is provided in the center of the one surface in a width direction (Y direction) perpendicular to a flow direction (X direction) of the refrigerant flowing in the refrigerant passage, an upstream partition plate equally bisecting the refrigerant passage is arranged upstream from positions of the tube which face the electronic components in the X direction. The upstream partition plate is twisted by 90°×n (n: an odd number), and has an upstream end provided to bisect the refrigerant passage in the Y direction and a downstream end provided to bisect the refrigerant passage in the orthogonal direction (Z direction). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2013089877A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2013089877A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2013089877A3</originalsourceid><addsrcrecordid>eNrjZGBz9vf3cQ3iYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBobGBhaWFubmjsZEKQIAIY8bPw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COOLER</title><source>esp@cenet</source><creator>SUGIURA SHUN ; IDE SHIGEO</creator><creatorcontrib>SUGIURA SHUN ; IDE SHIGEO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a cooler capable of having equal cooling capability on both surfaces of a tube while suppressing an increase in build.SOLUTION: The cooler includes at least one tube that has a medium passage where a refrigerant flows inside, both one surface and the reverse surface opposite from the one surface being cooling surfaces for cooling electronic components, and a refrigerant intake of the refrigerant passage being provided on the one surface side. The refrigerant intake is provided in the center of the one surface in a width direction (Y direction) perpendicular to a flow direction (X direction) of the refrigerant flowing in the refrigerant passage, an upstream partition plate equally bisecting the refrigerant passage is arranged upstream from positions of the tube which face the electronic components in the X direction. The upstream partition plate is twisted by 90°×n (n: an odd number), and has an upstream end provided to bisect the refrigerant passage in the Y direction and a downstream end provided to bisect the refrigerant passage in the orthogonal direction (Z direction).</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130513&DB=EPODOC&CC=JP&NR=2013089877A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130513&DB=EPODOC&CC=JP&NR=2013089877A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUGIURA SHUN</creatorcontrib><creatorcontrib>IDE SHIGEO</creatorcontrib><title>COOLER</title><description>PROBLEM TO BE SOLVED: To provide a cooler capable of having equal cooling capability on both surfaces of a tube while suppressing an increase in build.SOLUTION: The cooler includes at least one tube that has a medium passage where a refrigerant flows inside, both one surface and the reverse surface opposite from the one surface being cooling surfaces for cooling electronic components, and a refrigerant intake of the refrigerant passage being provided on the one surface side. The refrigerant intake is provided in the center of the one surface in a width direction (Y direction) perpendicular to a flow direction (X direction) of the refrigerant flowing in the refrigerant passage, an upstream partition plate equally bisecting the refrigerant passage is arranged upstream from positions of the tube which face the electronic components in the X direction. The upstream partition plate is twisted by 90°×n (n: an odd number), and has an upstream end provided to bisect the refrigerant passage in the Y direction and a downstream end provided to bisect the refrigerant passage in the orthogonal direction (Z direction).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZGBz9vf3cQ3iYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBobGBhaWFubmjsZEKQIAIY8bPw</recordid><startdate>20130513</startdate><enddate>20130513</enddate><creator>SUGIURA SHUN</creator><creator>IDE SHIGEO</creator><scope>EVB</scope></search><sort><creationdate>20130513</creationdate><title>COOLER</title><author>SUGIURA SHUN ; IDE SHIGEO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2013089877A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SUGIURA SHUN</creatorcontrib><creatorcontrib>IDE SHIGEO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUGIURA SHUN</au><au>IDE SHIGEO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COOLER</title><date>2013-05-13</date><risdate>2013</risdate><abstract>PROBLEM TO BE SOLVED: To provide a cooler capable of having equal cooling capability on both surfaces of a tube while suppressing an increase in build.SOLUTION: The cooler includes at least one tube that has a medium passage where a refrigerant flows inside, both one surface and the reverse surface opposite from the one surface being cooling surfaces for cooling electronic components, and a refrigerant intake of the refrigerant passage being provided on the one surface side. The refrigerant intake is provided in the center of the one surface in a width direction (Y direction) perpendicular to a flow direction (X direction) of the refrigerant flowing in the refrigerant passage, an upstream partition plate equally bisecting the refrigerant passage is arranged upstream from positions of the tube which face the electronic components in the X direction. The upstream partition plate is twisted by 90°×n (n: an odd number), and has an upstream end provided to bisect the refrigerant passage in the Y direction and a downstream end provided to bisect the refrigerant passage in the orthogonal direction (Z direction).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | COOLER |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T23%3A01%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SUGIURA%20SHUN&rft.date=2013-05-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2013089877A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |