SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

PROBLEM TO BE SOLVED: To suppress temperature drop of process liquid on a substrate during SPM processing.SOLUTION: In a substrate processing apparatus 1, liquid is discharged from a process liquid supply part 3 toward an upper surface 91 of a substrate 9 rotated by a substrate rotating mechanism 5....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUJITA ERI, FUJITANI YOSHINORI, TSUJIKAWA HIROTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!