METHOD FOR PRODUCING COMPOSITION FOR SILICA RESIN FILM, COMPOSITION FOR SILICA RESIN FILM, METHOD FOR FORMING SILICA RESIN FILM, AND SILICA RESIN FILM

PROBLEM TO BE SOLVED: To provide a technology capable of improving crack resistance in a thick silica resin film formed by high-temperature firing.SOLUTION: A method for producing a composition for a silica resin film with a thickness of ≥2.0 μm to be formed by high-temperature firing at ≥500°C incl...

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Bibliographische Detailangaben
Hauptverfasser: SAWADA YOSHIHIRO, MASUJIMA MASAHIRO, YAMADAYA TOKUNORI, SHIMATANI SATOSHI
Format: Patent
Sprache:eng
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