METHOD FOR MANUFACTURING ELECTRONIC PART AND PLATING APPARATUS

PROBLEM TO BE SOLVED: To deposit a ferrite plating film having a composition ratio not deviating from a metal ion concentration ratio introduced in a reaction solution, onto a surface of an object to be plated.SOLUTION: A method for manufacturing an electronic part comprises: a step of preparing a p...

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Bibliographische Detailangaben
1. Verfasser:	ODAWARA MITSURU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To deposit a ferrite plating film having a composition ratio not deviating from a metal ion concentration ratio introduced in a reaction solution, onto a surface of an object to be plated.SOLUTION: A method for manufacturing an electronic part comprises: a step of preparing a plating tank 4, a reaction solution 2 containing a bivalent iron ion or containing a bivalent iron ion and a bivalent metal ion other than iron and the object to be plated 1; and a step of depositing the ferrite plating film (not shown) onto the surface of the object to be plated 1 by introducing at least one chosen from pure water 5 and the reaction solution 2 and the object to be plated 1 into the plating tank. In the step of depositing the ferrite plating film onto the surface of the object to be plated, a constant distance is kept between the liquid surface of a liquid 9 in the plating tank 4 and the object to be plated 1.