SILICON SUBSTRATE INSPECTION DEVICE AND INSPECTION METHOD

PROBLEM TO BE SOLVED: To provide a silicon wafer inspection method and device configured to detect an internal crack even if gray level difference fo an image occurs due to unevenness of crystal grain boundary or an optical system.SOLUTION: A silicon wafer is irradiated with infrared illumination li...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	IMAGAWA TAKESHI
Format:	Patent
Sprache:	eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!