BONDED PLATE-LIKE BODY INSPECTION DEVICE AND METHOD

PROBLEM TO BE SOLVED: To provide a bonded plate-like body inspection device capable of obtaining information that can accurately show each size of many bubbles scattered in an adhesive agent.SOLUTION: A bonded plate-like body inspection device comprises: a line sensor camera 50; illumination means 5...

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Hauptverfasser: WAKABA HIROYUKI, ONO YOKO, SEKI KATSUTOSHI, HAYASHI YOSHINORI, IZUTSU TADASHI, GONDO TAKANORI
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creator WAKABA HIROYUKI
ONO YOKO
SEKI KATSUTOSHI
HAYASHI YOSHINORI
IZUTSU TADASHI
GONDO TAKANORI
description PROBLEM TO BE SOLVED: To provide a bonded plate-like body inspection device capable of obtaining information that can accurately show each size of many bubbles scattered in an adhesive agent.SOLUTION: A bonded plate-like body inspection device comprises: a line sensor camera 50; illumination means 51 and 52 for illuminating the line sensor camera 50 through a bonded plate-like body 10; and a processing unit for, when the line sensor camera scans the bonded plate-like body in a state of being illuminated by the illumination means, processing a picture signal to be output from the line sensor camera. The processing unit, from a gray value profile in a direction crossing a dark ring that is obtained from inspection image information consisting of a pixel-by-pixel gray value which is generated on the basis of the picture signal from the line sensor camera, generates bubble size information on the basis of distance between two dark parts corresponding to the dark ring on an inspection image.
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subjects INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
title BONDED PLATE-LIKE BODY INSPECTION DEVICE AND METHOD
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