PEELING APPARATUS, PEELING SYSTEM, PEELING METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM
PROBLEM TO BE SOLVED: To properly and efficiently perform a peeling process of a support substrate and a processed substrate.SOLUTION: A peeling apparatus 12 has: a first holding part 50 holding a processed wafer W through a dicing tape P; a second holding part 51 holding a surface of a dicing frame...
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| creator | SOMA YASUTAKA YOSHITAKA NAOTO MANABE EIJI HONDA MASARU HIRAKAWA OSAMU |
| description | PROBLEM TO BE SOLVED: To properly and efficiently perform a peeling process of a support substrate and a processed substrate.SOLUTION: A peeling apparatus 12 has: a first holding part 50 holding a processed wafer W through a dicing tape P; a second holding part 51 holding a surface of a dicing frame F at the outer side of the dicing tape P; a third holding part 52 holding a support wafer S; and a moving mechanism 90 holding an outer peripheral part of the third holding part 52 and moving the third holding part 52 in the vertical direction so that the support wafer S held by the third holding part 52 is continuously peeled from the processed wafer W, held by the first holding part 50, from the outer peripheral part side toward the center part thereof. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2013016579A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2013016579A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2013016579A3</originalsourceid><addsrcrecordid>eNrjZAgPcHX18fRzV3AMCHAMcgwJDdZRgAkFRwaHuPoi-L6uIR7-LkB-kL97kCNQwtHPRcHZ3zcgNMQ1SCE4xD_I0d0VqMrFM9SXh4E1LTGnOJUXSnMzKLm5hjh76KYW5MenFhckJqfmpZbEewUYGRgaGxiamZpbOhoTpQgAB4YxOQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PEELING APPARATUS, PEELING SYSTEM, PEELING METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM</title><source>esp@cenet</source><creator>SOMA YASUTAKA ; YOSHITAKA NAOTO ; MANABE EIJI ; HONDA MASARU ; HIRAKAWA OSAMU</creator><creatorcontrib>SOMA YASUTAKA ; YOSHITAKA NAOTO ; MANABE EIJI ; HONDA MASARU ; HIRAKAWA OSAMU</creatorcontrib><description>PROBLEM TO BE SOLVED: To properly and efficiently perform a peeling process of a support substrate and a processed substrate.SOLUTION: A peeling apparatus 12 has: a first holding part 50 holding a processed wafer W through a dicing tape P; a second holding part 51 holding a surface of a dicing frame F at the outer side of the dicing tape P; a third holding part 52 holding a support wafer S; and a moving mechanism 90 holding an outer peripheral part of the third holding part 52 and moving the third holding part 52 in the vertical direction so that the support wafer S held by the third holding part 52 is continuously peeled from the processed wafer W, held by the first holding part 50, from the outer peripheral part side toward the center part thereof.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130124&DB=EPODOC&CC=JP&NR=2013016579A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130124&DB=EPODOC&CC=JP&NR=2013016579A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SOMA YASUTAKA</creatorcontrib><creatorcontrib>YOSHITAKA NAOTO</creatorcontrib><creatorcontrib>MANABE EIJI</creatorcontrib><creatorcontrib>HONDA MASARU</creatorcontrib><creatorcontrib>HIRAKAWA OSAMU</creatorcontrib><title>PEELING APPARATUS, PEELING SYSTEM, PEELING METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM</title><description>PROBLEM TO BE SOLVED: To properly and efficiently perform a peeling process of a support substrate and a processed substrate.SOLUTION: A peeling apparatus 12 has: a first holding part 50 holding a processed wafer W through a dicing tape P; a second holding part 51 holding a surface of a dicing frame F at the outer side of the dicing tape P; a third holding part 52 holding a support wafer S; and a moving mechanism 90 holding an outer peripheral part of the third holding part 52 and moving the third holding part 52 in the vertical direction so that the support wafer S held by the third holding part 52 is continuously peeled from the processed wafer W, held by the first holding part 50, from the outer peripheral part side toward the center part thereof.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgPcHX18fRzV3AMCHAMcgwJDdZRgAkFRwaHuPoi-L6uIR7-LkB-kL97kCNQwtHPRcHZ3zcgNMQ1SCE4xD_I0d0VqMrFM9SXh4E1LTGnOJUXSnMzKLm5hjh76KYW5MenFhckJqfmpZbEewUYGRgaGxiamZpbOhoTpQgAB4YxOQ</recordid><startdate>20130124</startdate><enddate>20130124</enddate><creator>SOMA YASUTAKA</creator><creator>YOSHITAKA NAOTO</creator><creator>MANABE EIJI</creator><creator>HONDA MASARU</creator><creator>HIRAKAWA OSAMU</creator><scope>EVB</scope></search><sort><creationdate>20130124</creationdate><title>PEELING APPARATUS, PEELING SYSTEM, PEELING METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM</title><author>SOMA YASUTAKA ; YOSHITAKA NAOTO ; MANABE EIJI ; HONDA MASARU ; HIRAKAWA OSAMU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2013016579A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SOMA YASUTAKA</creatorcontrib><creatorcontrib>YOSHITAKA NAOTO</creatorcontrib><creatorcontrib>MANABE EIJI</creatorcontrib><creatorcontrib>HONDA MASARU</creatorcontrib><creatorcontrib>HIRAKAWA OSAMU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SOMA YASUTAKA</au><au>YOSHITAKA NAOTO</au><au>MANABE EIJI</au><au>HONDA MASARU</au><au>HIRAKAWA OSAMU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PEELING APPARATUS, PEELING SYSTEM, PEELING METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM</title><date>2013-01-24</date><risdate>2013</risdate><abstract>PROBLEM TO BE SOLVED: To properly and efficiently perform a peeling process of a support substrate and a processed substrate.SOLUTION: A peeling apparatus 12 has: a first holding part 50 holding a processed wafer W through a dicing tape P; a second holding part 51 holding a surface of a dicing frame F at the outer side of the dicing tape P; a third holding part 52 holding a support wafer S; and a moving mechanism 90 holding an outer peripheral part of the third holding part 52 and moving the third holding part 52 in the vertical direction so that the support wafer S held by the third holding part 52 is continuously peeled from the processed wafer W, held by the first holding part 50, from the outer peripheral part side toward the center part thereof.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | PEELING APPARATUS, PEELING SYSTEM, PEELING METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T17%3A00%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SOMA%20YASUTAKA&rft.date=2013-01-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2013016579A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |