BALL LOADING APPARATUS, BALL LOADING METHOD, BALL-LOADED BOARD AND ELECTRONIC COMPONENT MOUNTED BOARD

PROBLEM TO BE SOLVED: To improve the ball loading efficiency while suppressing the manufacturing cost.SOLUTION: The ball loading apparatus includes: a suction head 2 that holds solder balls 300; a support section 3 that supports the suction head 2; and a drive mechanism 4 that drives the support sec...

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1. Verfasser:	TOMOI TADASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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