SEMICONDUCTOR INTEGRATED DEVICE

PROBLEM TO BE SOLVED: To increase the number of terminals for connecting chips in a SiP (System in Package).SOLUTION: A semiconductor integrated circuit includes a first semiconductor chip and a second semiconductor chip which are integrated in a package. The first semiconductor chip includes a firs...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YASUKAWA TOMONORI, UENO TOMOO, KAWAI KAZUYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES
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