ORGANIC SILICON COMPOUND AND PRETREATMENT METHOD FOR ELECTROLESS PLATING USING ORGANIC SILICON COMPOUND
PROBLEM TO BE SOLVED: To provide an organic silicon compound suitable as an aqueous silane coupling agent, being simple and reduced in environmental burden, which can exhibit favorable adhesion with a metal plating layer; and to provide a pretreatment method for electroless plating using the same.SO...
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creator | OKIMOTO YOSHIO |
description | PROBLEM TO BE SOLVED: To provide an organic silicon compound suitable as an aqueous silane coupling agent, being simple and reduced in environmental burden, which can exhibit favorable adhesion with a metal plating layer; and to provide a pretreatment method for electroless plating using the same.SOLUTION: The organic silicon compound which is a final product is obtained by: allowing a compound represented by general formula (1) to react with at least one of polycarboxylic acid anhydride selected from the group consisting of tetracarboxylic monoanhydride, tetracarboxylic dianhydride, and tricarboxylic monoanhydride to obtain a reaction product as an intermediate product; and further allowing the intermediate product to react with a compound represented by general formula (3). A pretreatment method for electroless plating using the same is also provided. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2013001935A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2013001935A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2013001935A3</originalsourceid><addsrcrecordid>eNrjZEj3D3J39PN0Vgj29PF09vdTcPb3DfAP9XNRcATigCDXkCBXxxBfV78QBV_XEA9_FwU3_yAFVx9X55Agfx_X4GCFAB_HEE8_d4XQYBCJyzgeBta0xJziVF4ozc2g5OYa4uyhm1qQH59aXJCYnJqXWhLvFWBkYGhsYGBoaWzqaEyUIgCD0zYU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ORGANIC SILICON COMPOUND AND PRETREATMENT METHOD FOR ELECTROLESS PLATING USING ORGANIC SILICON COMPOUND</title><source>esp@cenet</source><creator>OKIMOTO YOSHIO</creator><creatorcontrib>OKIMOTO YOSHIO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide an organic silicon compound suitable as an aqueous silane coupling agent, being simple and reduced in environmental burden, which can exhibit favorable adhesion with a metal plating layer; and to provide a pretreatment method for electroless plating using the same.SOLUTION: The organic silicon compound which is a final product is obtained by: allowing a compound represented by general formula (1) to react with at least one of polycarboxylic acid anhydride selected from the group consisting of tetracarboxylic monoanhydride, tetracarboxylic dianhydride, and tricarboxylic monoanhydride to obtain a reaction product as an intermediate product; and further allowing the intermediate product to react with a compound represented by general formula (3). A pretreatment method for electroless plating using the same is also provided.</description><language>eng</language><subject>ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; ORGANIC CHEMISTRY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130107&DB=EPODOC&CC=JP&NR=2013001935A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130107&DB=EPODOC&CC=JP&NR=2013001935A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKIMOTO YOSHIO</creatorcontrib><title>ORGANIC SILICON COMPOUND AND PRETREATMENT METHOD FOR ELECTROLESS PLATING USING ORGANIC SILICON COMPOUND</title><description>PROBLEM TO BE SOLVED: To provide an organic silicon compound suitable as an aqueous silane coupling agent, being simple and reduced in environmental burden, which can exhibit favorable adhesion with a metal plating layer; and to provide a pretreatment method for electroless plating using the same.SOLUTION: The organic silicon compound which is a final product is obtained by: allowing a compound represented by general formula (1) to react with at least one of polycarboxylic acid anhydride selected from the group consisting of tetracarboxylic monoanhydride, tetracarboxylic dianhydride, and tricarboxylic monoanhydride to obtain a reaction product as an intermediate product; and further allowing the intermediate product to react with a compound represented by general formula (3). A pretreatment method for electroless plating using the same is also provided.</description><subject>ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>ORGANIC CHEMISTRY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEj3D3J39PN0Vgj29PF09vdTcPb3DfAP9XNRcATigCDXkCBXxxBfV78QBV_XEA9_FwU3_yAFVx9X55Agfx_X4GCFAB_HEE8_d4XQYBCJyzgeBta0xJziVF4ozc2g5OYa4uyhm1qQH59aXJCYnJqXWhLvFWBkYGhsYGBoaWzqaEyUIgCD0zYU</recordid><startdate>20130107</startdate><enddate>20130107</enddate><creator>OKIMOTO YOSHIO</creator><scope>EVB</scope></search><sort><creationdate>20130107</creationdate><title>ORGANIC SILICON COMPOUND AND PRETREATMENT METHOD FOR ELECTROLESS PLATING USING ORGANIC SILICON COMPOUND</title><author>OKIMOTO YOSHIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2013001935A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>ORGANIC CHEMISTRY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>OKIMOTO YOSHIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OKIMOTO YOSHIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ORGANIC SILICON COMPOUND AND PRETREATMENT METHOD FOR ELECTROLESS PLATING USING ORGANIC SILICON COMPOUND</title><date>2013-01-07</date><risdate>2013</risdate><abstract>PROBLEM TO BE SOLVED: To provide an organic silicon compound suitable as an aqueous silane coupling agent, being simple and reduced in environmental burden, which can exhibit favorable adhesion with a metal plating layer; and to provide a pretreatment method for electroless plating using the same.SOLUTION: The organic silicon compound which is a final product is obtained by: allowing a compound represented by general formula (1) to react with at least one of polycarboxylic acid anhydride selected from the group consisting of tetracarboxylic monoanhydride, tetracarboxylic dianhydride, and tricarboxylic monoanhydride to obtain a reaction product as an intermediate product; and further allowing the intermediate product to react with a compound represented by general formula (3). A pretreatment method for electroless plating using the same is also provided.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY ORGANIC CHEMISTRY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | ORGANIC SILICON COMPOUND AND PRETREATMENT METHOD FOR ELECTROLESS PLATING USING ORGANIC SILICON COMPOUND |
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