ORGANIC SILICON COMPOUND AND PRETREATMENT METHOD FOR ELECTROLESS PLATING USING ORGANIC SILICON COMPOUND

PROBLEM TO BE SOLVED: To provide an organic silicon compound suitable as an aqueous silane coupling agent, being simple and reduced in environmental burden, which can exhibit favorable adhesion with a metal plating layer; and to provide a pretreatment method for electroless plating using the same.SO...

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description PROBLEM TO BE SOLVED: To provide an organic silicon compound suitable as an aqueous silane coupling agent, being simple and reduced in environmental burden, which can exhibit favorable adhesion with a metal plating layer; and to provide a pretreatment method for electroless plating using the same.SOLUTION: The organic silicon compound which is a final product is obtained by: allowing a compound represented by general formula (1) to react with at least one of polycarboxylic acid anhydride selected from the group consisting of tetracarboxylic monoanhydride, tetracarboxylic dianhydride, and tricarboxylic monoanhydride to obtain a reaction product as an intermediate product; and further allowing the intermediate product to react with a compound represented by general formula (3). A pretreatment method for electroless plating using the same is also provided.
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subjects ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
ORGANIC CHEMISTRY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title ORGANIC SILICON COMPOUND AND PRETREATMENT METHOD FOR ELECTROLESS PLATING USING ORGANIC SILICON COMPOUND
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