CONNECTION STRUCTURE OF WIRING BODIES, WIRING BODY, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD OF ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a connection structure of wiring bodies which achieves high heat radiation performance, enables easy assembly of each wiring body, and also enables defects to be easily replaced in an electronic apparatus formed by combining the multiple wiring bodies formed with ele...

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Bibliographische Detailangaben
Hauptverfasser: SAITO HIROHISA, AKAHA YOSHIHIRO, UENISHI NAOTA
Format: Patent
Sprache:eng
Schlagworte:
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a connection structure of wiring bodies which achieves high heat radiation performance, enables easy assembly of each wiring body, and also enables defects to be easily replaced in an electronic apparatus formed by combining the multiple wiring bodies formed with electronic components mounted thereon.SOLUTION: A connection structure of wiring bodies 100 connects multiple wiring bodies 1. The wiring body includes: a metal plate 2 having heat conductivity; a flexible printed wiring board 3 laminated on the metal plate via an adhesive material; and electronic components 9 mounted on the flexible printed wiring board. While a first connection part 10, formed by extending a part of the flexible printed wiring board from at least one side edge part of the metal plate, is provided, a second connection part 13, connecting with the first connection part of a wiring body adjacently located, is provided in at least the other side edge part of the metal plate. Further, the wiring body includes metal plate coupling means 5, 6, 14 connecting the metal plates with each other.