LEAD FRAME, SEMICONDUCTOR DEVICE HAVING THE LEAD FRAME, AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To prevent the occurrence of cracks in a sealing resin while preventing the formation of resin burrs.SOLUTION: A semiconductor device has: a semiconductor chip 1; a die pad 2A having the semiconductor chip 1 fixed on the top face thereof with an adhesive member 3; a lead frame 2 having leads 2B arranged around the die pad 2A and suspension leads 2C connected to the die pad 2A; thin metal wires 4 which electrically connect the semiconductor chip 1 with the leads 2B; and a sealing resin 5 which integrally seals the semiconductor chip 1, the die pad 2A, the leads 2B, the suspension leads 2C and the thin metal wires 4. A step portion 6 is provided on the peripheral part 2p of the die pad 2A. The undersurface of a part except the peripheral part 2p of the die pad 2A is exposed from the sealing resin 5. The sealing resin 5 enters the inside of the step portion 6. The depth of the step portion 6 increases from the step surface of the step portion 6 toward the side face of the die pad 2A.