RESIN MOLDED ARTICLE
PROBLEM TO BE SOLVED: To provide a resin molded article excellent in heat dissipation characteristic, enabling reduction in the number of processing man-hours and assembling man-hours for imparting the heat dissipation characteristic.SOLUTION: A part 1A of a metallic member 1 for electric wiring is...
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| creator | KAMIHOGI YUTETSU IWATSUKI YASUHITO |
| description | PROBLEM TO BE SOLVED: To provide a resin molded article excellent in heat dissipation characteristic, enabling reduction in the number of processing man-hours and assembling man-hours for imparting the heat dissipation characteristic.SOLUTION: A part 1A of a metallic member 1 for electric wiring is directly embedded in a first resin molded portion 3 made of a first thermoplastic resin 2, and a part of the first resin molded portion 3 is embedded in a second resin molded portion 9 made of a second thermoplastic resin having lower thermal conductivity than that of the first thermoplastic resin 2, so as to integrate the metallic member 1 for electric wiring, the first resin molded portion 3 and the second resin molded portion 9 with each other. The first resin molded portion 3 includes a part which is not embedded in the second resin molded portion 9 and is exposed to the outside, and thickness t of a thermoplastic resin layer 3A formed of the first thermoplastic resin 2 leading from an exposed surface 3B of this part to the metallic member 1 for electric wiring is chosen to be 0.4-1 mm. |
| format | Patent |
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The first resin molded portion 3 includes a part which is not embedded in the second resin molded portion 9 and is exposed to the outside, and thickness t of a thermoplastic resin layer 3A formed of the first thermoplastic resin 2 leading from an exposed surface 3B of this part to the metallic member 1 for electric wiring is chosen to be 0.4-1 mm.</description><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121206&DB=EPODOC&CC=JP&NR=2012236298A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121206&DB=EPODOC&CC=JP&NR=2012236298A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAMIHOGI YUTETSU</creatorcontrib><creatorcontrib>IWATSUKI YASUHITO</creatorcontrib><title>RESIN MOLDED ARTICLE</title><description>PROBLEM TO BE SOLVED: To provide a resin molded article excellent in heat dissipation characteristic, enabling reduction in the number of processing man-hours and assembling man-hours for imparting the heat dissipation characteristic.SOLUTION: A part 1A of a metallic member 1 for electric wiring is directly embedded in a first resin molded portion 3 made of a first thermoplastic resin 2, and a part of the first resin molded portion 3 is embedded in a second resin molded portion 9 made of a second thermoplastic resin having lower thermal conductivity than that of the first thermoplastic resin 2, so as to integrate the metallic member 1 for electric wiring, the first resin molded portion 3 and the second resin molded portion 9 with each other. The first resin molded portion 3 includes a part which is not embedded in the second resin molded portion 9 and is exposed to the outside, and thickness t of a thermoplastic resin layer 3A formed of the first thermoplastic resin 2 leading from an exposed surface 3B of this part to the metallic member 1 for electric wiring is chosen to be 0.4-1 mm.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJcg329FPw9fdxcXVRcAwK8XT2ceVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhkZGxmZGlhaOxkQpAgCoYR7v</recordid><startdate>20121206</startdate><enddate>20121206</enddate><creator>KAMIHOGI YUTETSU</creator><creator>IWATSUKI YASUHITO</creator><scope>EVB</scope></search><sort><creationdate>20121206</creationdate><title>RESIN MOLDED ARTICLE</title><author>KAMIHOGI YUTETSU ; IWATSUKI YASUHITO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2012236298A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>KAMIHOGI YUTETSU</creatorcontrib><creatorcontrib>IWATSUKI YASUHITO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAMIHOGI YUTETSU</au><au>IWATSUKI YASUHITO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN MOLDED ARTICLE</title><date>2012-12-06</date><risdate>2012</risdate><abstract>PROBLEM TO BE SOLVED: To provide a resin molded article excellent in heat dissipation characteristic, enabling reduction in the number of processing man-hours and assembling man-hours for imparting the heat dissipation characteristic.SOLUTION: A part 1A of a metallic member 1 for electric wiring is directly embedded in a first resin molded portion 3 made of a first thermoplastic resin 2, and a part of the first resin molded portion 3 is embedded in a second resin molded portion 9 made of a second thermoplastic resin having lower thermal conductivity than that of the first thermoplastic resin 2, so as to integrate the metallic member 1 for electric wiring, the first resin molded portion 3 and the second resin molded portion 9 with each other. The first resin molded portion 3 includes a part which is not embedded in the second resin molded portion 9 and is exposed to the outside, and thickness t of a thermoplastic resin layer 3A formed of the first thermoplastic resin 2 leading from an exposed surface 3B of this part to the metallic member 1 for electric wiring is chosen to be 0.4-1 mm.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | RESIN MOLDED ARTICLE |
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