SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To improve the strength of a sealing member for an electronic component package which is used as a second sealing member of an electronic component package hermetically sealing an electrode of an electronic component element with a first sealing member and the second sealing me...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KODA NAOKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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