SUBSTRATE FOR SEMICONDUCTOR DEVICE, RESIN SEALED TYPE SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING RESIN SEALED TYPE SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To sufficiently reduce the size of a substrate for a semiconductor device and a resin sealed type semiconductor device in a plane direction.SOLUTION: A substrate 10 for a semiconductor device includes a substrate 1, a plurality of external terminal sections 12p and 12q that are disposed in plane on the substrate 1 and have external terminal surfaces 12pb and 12qb directed to the substrate 1 side, and a plurality of internal terminal sections 11 that are disposed in plane on the substrate 1 and have internal terminal surfaces 11a opposed to the substrate 1. The internal terminal sections 11 and the external terminal sections 12p and 12q are connected with a wiring section 17. A part of the external terminal sections 12p is disposed within a predetermined disposition region A which exists on the substrate 1 and on which semiconductor devices 50 are to be disposed. The external terminal sections 12q other than the part of the external terminal sections 12p are disposed at the outside of the predetermined disposition region A which exists on the substrate 1.