STAMPER FOR MOLDING MICROSTRUCTURE, SUBSTRATE FOR MOLDING MICROSTRUCTURE USING THE SAME, AND METHOD FOR MANUFACTURING THE STAMPER

PROBLEM TO BE SOLVED: To provide a large-sized stamper for molding microstructure which is constituted by connecting small stampers having microstructures formed thereon while suppressing pitch slippage of the microstructures at a joint between stampers, and to provide a sheet for molding microstruc...

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Bibliographische Detailangaben
1. Verfasser:	OSHIMA KATSUNORI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a large-sized stamper for molding microstructure which is constituted by connecting small stampers having microstructures formed thereon while suppressing pitch slippage of the microstructures at a joint between stampers, and to provide a sheet for molding microstructure using the same.SOLUTION: A number of small microstructures 12 are concentrically or spirally formed on the upper surface of a disk-like sheet 11, and large microstructures 13 are formed at four corners that are located at the outermost periphery thereof. The disk-like sheet 11 is cut along the four large microstructures 13; thereby a rectangular sheet 72 is formed. A plurality of rectangular sheets 72 are flatly connected to manufacture a large-area sheet 73. Thus, the cutting position of the disk-like sheet 11 can be accurately set, and the periodicity of the small microstructures 12 can be maintained at the connecting portion.