MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a mounting structure of a semiconductor device that achieves further space-saving and can ensure the connection reliability.SOLUTION: A mounting structure of a semiconductor device comprises: a wiring substrate 2 that has a wiring layer 7 formed on a part of a base 5...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KARASAWA JUN, NAKAJIMA HAJIME, MORI MIKI, HIYAMA KOHEI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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