SUCTION NOZZLE, MOUNTING APPARATUS, MOUNTING METHOD OF ELECTRONIC COMPONENTS, AND MANUFACTURING METHOD OF MOUNTING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a technology such as a suction nozzle which prevents false recognition of the suction state of an electronic component to the suction nozzle.SOLUTION: A suction nozzle according to one embodiment of this technology includes a first suction region and a second suction...

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Bibliographische Detailangaben
1. Verfasser:	KANO TETSUYA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a technology such as a suction nozzle which prevents false recognition of the suction state of an electronic component to the suction nozzle.SOLUTION: A suction nozzle according to one embodiment of this technology includes a first suction region and a second suction region. The first suction region has a first electrode and a second electrode and is formed by opening a region corresponding to the first electrode of a first electronic component mounted on a mounting substrate. The second suction region is formed by opening a region corresponding to the second electrode.