DRIVER MODULE STRUCTURE AND METHOD OF MANUFACTURING DRIVER MODULE

PROBLEM TO BE SOLVED: To provide a driver module structure and a method of manufacturing a driver module which can reduce costs by facilitating processing of a heat radiation body while maintaining heat radiation by ensuring adhesion between the heat radiation body and a semiconductor device.SOLUTIO...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YUMOTO SHIGEO, YAMAGUCHI AKIYA
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LABELS OR NAME-PLATES PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS
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