MOISTURE CURING ADHESIVE COMPOSITION EXCELLENT IN ADHESIVENESS TO POLYETHYLENE RESIN OR POLYPROPYLENE RESIN, AND ADHEREND OR ADHESION METHOD USING THE SAME

PROBLEM TO BE SOLVED: To provide an adhesive composition having excellent adhesiveness to a polyethylene resin or a polypropylene resin and having low viscosity without deteriorating adhesiveness to these resins and a curing rate; and to provide an adherend or an adhesion method using the adhesive c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HAYASHI MASAYA, IYO KAZUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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