MOISTURE CURING ADHESIVE COMPOSITION EXCELLENT IN ADHESIVENESS TO POLYETHYLENE RESIN OR POLYPROPYLENE RESIN, AND ADHEREND OR ADHESION METHOD USING THE SAME

MOISTURE CURING ADHESIVE COMPOSITION EXCELLENT IN ADHESIVENESS TO POLYETHYLENE RESIN OR POLYPROPYLENE RESIN, AND ADHEREND OR ADHESION METHOD USING THE SAME

PROBLEM TO BE SOLVED: To provide an adhesive composition having excellent adhesiveness to a polyethylene resin or a polypropylene resin and having low viscosity without deteriorating adhesiveness to these resins and a curing rate; and to provide an adherend or an adhesion method using the adhesive c...

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Hauptverfasser: HAYASHI MASAYA, IYO KAZUHIRO
Format: Patent
Sprache:eng
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ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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creator HAYASHI MASAYA
IYO KAZUHIRO
description PROBLEM TO BE SOLVED: To provide an adhesive composition having excellent adhesiveness to a polyethylene resin or a polypropylene resin and having low viscosity without deteriorating adhesiveness to these resins and a curing rate; and to provide an adherend or an adhesion method using the adhesive composition.SOLUTION: The moisture curing adhesive composition for adhesion of a polyethylene resin and/or a polypropylene resin includes: a curable resin (A) having a crosslinkable silicon group in the molecule; a tackifying resin (B); a reactive diluent (C) which is an alkyl alkoxy silane compound or an aryl alkoxy silane compound with the molecular weight of
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and to provide an adherend or an adhesion method using the adhesive composition.SOLUTION: The moisture curing adhesive composition for adhesion of a polyethylene resin and/or a polypropylene resin includes: a curable resin (A) having a crosslinkable silicon group in the molecule; a tackifying resin (B); a reactive diluent (C) which is an alkyl alkoxy silane compound or an aryl alkoxy silane compound with the molecular weight of &lt;1,000; and a boron trifluoride complex (D).</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20121018&amp;DB=EPODOC&amp;CC=JP&amp;NR=2012197388A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20121018&amp;DB=EPODOC&amp;CC=JP&amp;NR=2012197388A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAYASHI MASAYA</creatorcontrib><creatorcontrib>IYO KAZUHIRO</creatorcontrib><title>MOISTURE CURING ADHESIVE COMPOSITION EXCELLENT IN ADHESIVENESS TO POLYETHYLENE RESIN OR POLYPROPYLENE RESIN, AND ADHEREND OR ADHESION METHOD USING THE SAME</title><description>PROBLEM TO BE SOLVED: To provide an adhesive composition having excellent adhesiveness to a polyethylene resin or a polypropylene resin and having low viscosity without deteriorating adhesiveness to these resins and a curing rate; 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subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
title MOISTURE CURING ADHESIVE COMPOSITION EXCELLENT IN ADHESIVENESS TO POLYETHYLENE RESIN OR POLYPROPYLENE RESIN, AND ADHEREND OR ADHESION METHOD USING THE SAME
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