METHOD FOR MANUFACTURING METAL-CERAMIC BONDED SUBSTRATE

METHOD FOR MANUFACTURING METAL-CERAMIC BONDED SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal-ceramic bonded substrate by which random cracking is prevented from occurring in a ceramic substrate while the productivity is improved.SOLUTION: The method is for manufacturing a metal-ceramic bonded substrate, by which a bonded su...

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Hauptverfasser: IKUTA HIROYUKI, SUGIURA NAOKUNI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASTING
CASTING OF METALS
CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
POWDER METALLURGY
SEMICONDUCTOR DEVICES
TRANSPORTING
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creator IKUTA HIROYUKI
SUGIURA NAOKUNI
description PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal-ceramic bonded substrate by which random cracking is prevented from occurring in a ceramic substrate while the productivity is improved.SOLUTION: The method is for manufacturing a metal-ceramic bonded substrate, by which a bonded substrate 60 with an aluminum substrate (metal substrate) 80 bonded to an aluminum nitride substrate (ceramic substrate) 70 is manufactured by die casting. The method for manufacturing a metal-ceramic bonded substrate includes a placement step of forming recesses 70c on the other end surface 70b of the aluminum nitride substrate 70, and placing the aluminum nitride substrate 70 whose other end surface 70b is divided into a plurality of areas AR with the recesses 70c, in a movable mold 11.
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subjects BASIC ELECTRIC ELEMENTS
CASTING
CASTING OF METALS
CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
POWDER METALLURGY
SEMICONDUCTOR DEVICES
TRANSPORTING
title METHOD FOR MANUFACTURING METAL-CERAMIC BONDED SUBSTRATE
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