LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a low-cost LED package and a method for manufacturing the same.SOLUTION: The LED package comprises a first and a second lead frames isolated from each other; an LED chip which is provided above the first and the seconde lead frames and in which a terminal is connected to the first lead frame and the other terminal is connected to the second lead frame; and a resin body covering the LED chip, and a part of a top surface, a bottom surface and an end surface of each of the first and the second lead frame, and exposing residual parts of the bottom surface and the end surface. The resin body comprises a first part which is arranged between at least of the top surface of the LED and an area immediately above the LED chip on a top surface of the resin body and transmits light emitted from the LED chip; and a second part which surrounds the first part and has the transmittance of light being lower than that in the first part. The shape of the resin body defines a shape of the LED package.