EPOXY RESIN COMPOSITION FOR INJECTION MOLDING, AND COIL COMPONENT

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for injection molding, excellent in injection moldability because of having sufficient fluidity during molding, and also excellent in thermal conductivity and crack resistance after being cured; and to provide a highly reliable coil compone...

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Bibliographische Detailangaben
Hauptverfasser:	TOGANE HIDEKAZU, FUKUKAWA HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin composition for injection molding, excellent in injection moldability because of having sufficient fluidity during molding, and also excellent in thermal conductivity and crack resistance after being cured; and to provide a highly reliable coil component formed by sealing-molding a coil by using the composition.SOLUTION: The epoxy resin composition for injection molding contains, as indispensable components: a solid epoxy resin having a bisphenol A type epoxy resin having an average epoxy equivalent of 400-490 as a main component; a solid phenol resin-curing agent containing a ≥70 mass% multifunctional phenol resin having a polycondensation unit with phenols, benzaldehydes and/or hydroxybenzaldehydes with respect to the whole amount of the curing agent; silica; and a dimethylurea-based curing accelerator, wherein the silica is contained as much as 75-90 mass% to the whole amount of the resin composition. The coil component is obtained by sealing a coil by injection-molding the composition.