SEMICONDUCTOR MODULE
PROBLEM TO BE SOLVED: To provide a semiconductor module in which a plurality of semiconductor chips are mounted thereon and which can be manufactured at a high yield.SOLUTION: In a semiconductor module 10, six semiconductor chips 12 are mounted and arranged in 3×3 on a lead frame 11. A clip lead 13...
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| creator | OGINO HIROYUKI UENO SHIGENORI |
| description | PROBLEM TO BE SOLVED: To provide a semiconductor module in which a plurality of semiconductor chips are mounted thereon and which can be manufactured at a high yield.SOLUTION: In a semiconductor module 10, six semiconductor chips 12 are mounted and arranged in 3×3 on a lead frame 11. A clip lead 13 are further mounted thereon. The electrical connection from the semiconductor module 10 to an external is performed by a fist lead 112 as a part of the lead frame 11, a second lead 15 and third lead 16 attached to the lead frame 11 through an insulating part 14. Twenty-four circular openings are provided on a clip lead body 131. Six convex parts are provided on a rear face of the clip lead body 131. The six convex parts are formed so as to correspond to six semiconductor chips 12, and are joined to semiconductor chips 12 via solder layers respectively. |
| format | Patent |
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A clip lead 13 are further mounted thereon. The electrical connection from the semiconductor module 10 to an external is performed by a fist lead 112 as a part of the lead frame 11, a second lead 15 and third lead 16 attached to the lead frame 11 through an insulating part 14. Twenty-four circular openings are provided on a clip lead body 131. Six convex parts are provided on a rear face of the clip lead body 131. 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A clip lead 13 are further mounted thereon. The electrical connection from the semiconductor module 10 to an external is performed by a fist lead 112 as a part of the lead frame 11, a second lead 15 and third lead 16 attached to the lead frame 11 through an insulating part 14. Twenty-four circular openings are provided on a clip lead body 131. Six convex parts are provided on a rear face of the clip lead body 131. The six convex parts are formed so as to correspond to six semiconductor chips 12, and are joined to semiconductor chips 12 via solder layers respectively.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR MODULE |
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