FUNCTIONAL FILM AND METHOD FOR MANUFACTURING FUNCTIONAL FILM

PROBLEM TO BE SOLVED: To provide a method for manufacturing a functional film, which can develop a target gas barrier performance according to a film thickness and also stably form a gas barrier film excellent in temporal stability when forming an inorganic film by a plasma chemical vapor deposition...

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Bibliographische Detailangaben
Hauptverfasser:	TONOHARA KOUJI, FUJINAWA ATSUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing a functional film, which can develop a target gas barrier performance according to a film thickness and also stably form a gas barrier film excellent in temporal stability when forming an inorganic film by a plasma chemical vapor deposition (CVD) while conveying a long substrate having a surface formed of an organic material in a longitudinal direction.SOLUTION: In the method for manufacturing a functional film, a plasma electron density exerted at the most upstream position in a conveyance direction of the substrate is controlled lower than that at the most downstream position between electrodes in an electrode pair.