ELECTRONIC CIRCUIT MODULE COMPONENT

ELECTRONIC CIRCUIT MODULE COMPONENT

PROBLEM TO BE SOLVED: To facilitate the ventilation of gas such as moisture vapor occurred in the interior of an electronic circuit module component, in which a surface of a sealing resin is covered with a layer having conductivity, to the exterior by heating the electronic circuit module component....

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Hauptverfasser: ASAMI SHIGERU, HARA HIROKI, TAKIZAWA SHUICHI, TAJIMA MORIKAZU, KAMEDA MASUMI, KAWABATA KENICHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator ASAMI SHIGERU
HARA HIROKI
TAKIZAWA SHUICHI
TAJIMA MORIKAZU
KAMEDA MASUMI
KAWABATA KENICHI
description PROBLEM TO BE SOLVED: To facilitate the ventilation of gas such as moisture vapor occurred in the interior of an electronic circuit module component, in which a surface of a sealing resin is covered with a layer having conductivity, to the exterior by heating the electronic circuit module component.SOLUTION: An electronic circuit module component 1 includes electronic components 2, a substrate 3 which the electronic components 2 are mounted by solder 6, a sealing resin 4 covering the electronic components 2 and the substrate 3, and a porous conductive layer 5 which is a conductive material having multiple cavities, covers at least part of the sealing resin 4, and electrically connects with a ground 8 of the substrate 3.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ELECTRONIC CIRCUIT MODULE COMPONENT
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