SUBSTRATE FOR MOUNTING ELEMENT, MANUFACTURING METHOD OF SUBSTRATE FOR MOUNTING ELEMENT, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To improve connection reliability between a projection structure and an electrode of a semiconductor element in a structure connecting the projection structure and the electrode of the semiconductor element.SOLUTION: An element mounting substrate 10 comprises: an insulating res...

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Bibliographische Detailangaben
Hauptverfasser:	ITO KATSUMI, NAKAZATO MAYUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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