SUBSTRATE FOR MOUNTING ELEMENT, MANUFACTURING METHOD OF SUBSTRATE FOR MOUNTING ELEMENT, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE

SUBSTRATE FOR MOUNTING ELEMENT, MANUFACTURING METHOD OF SUBSTRATE FOR MOUNTING ELEMENT, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To improve connection reliability between a projection structure and an electrode of a semiconductor element in a structure connecting the projection structure and the electrode of the semiconductor element.SOLUTION: An element mounting substrate 10 comprises: an insulating res...

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Hauptverfasser: ITO KATSUMI, NAKAZATO MAYUMI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator ITO KATSUMI
NAKAZATO MAYUMI
description PROBLEM TO BE SOLVED: To improve connection reliability between a projection structure and an electrode of a semiconductor element in a structure connecting the projection structure and the electrode of the semiconductor element.SOLUTION: An element mounting substrate 10 comprises: an insulating resin layer 12; a wiring layer 14 provided on one main surface of the insulating resin layer 12; and a projection electrode 16 which is electrically connected to the wiring layer 14 and projects from the wiring layer 14 toward the insulating resin layer 12 side. Unevenness is formed on a side surface of the projection electrode 16, and the side surface of the projection electrode 16 is larger in surface roughness than a top surface of the projection electrode 16.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SUBSTRATE FOR MOUNTING ELEMENT, MANUFACTURING METHOD OF SUBSTRATE FOR MOUNTING ELEMENT, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE
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