METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ELECTRICAL APPLIANCE USING THE DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, in which, when a thick gate oxide film sufficient to secure a gate breakdown voltage of a high-voltage transistor is formed, the thick gate oxide film can be prevented from being reduced in thickness at the boundary...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HIKITA TOMOYUKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!