BOARD PLATING METHOD AND MANUFACTURING METHOD OF CIRCUIT BOARD UTILIZING THE SAME

PROBLEM TO BE SOLVED: To provide a board plating method and a manufacturing method of a circuit board utilizing the same which can improve the plating deviation between circuit boards by minimizing the deviation in plating thickness in a dummy region of a circuit board region arranged at the outline...

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Bibliographische Detailangaben
Hauptverfasser:	NAM HYO SEUNG, JEONG CHU-SIK, MOON JOENG-HO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a board plating method and a manufacturing method of a circuit board utilizing the same which can improve the plating deviation between circuit boards by minimizing the deviation in plating thickness in a dummy region of a circuit board region arranged at the outline of a panel board.SOLUTION: A manufacturing method of a circuit board comprises: a step of providing a panel board sectioned into a circuit board region and a dummy region; a step of calculating the proportion of the area of a circuit pattern formed by plating in the circuit board region; a step of deciding the proportion of the area of the dummy region to be plated after considering the proportion of the plated area in the circuit board region; a step of setting a part to be plated in the circuit board region and the dummy region; and a step of forming the circuit pattern by performing electrolytic plating on the panel board.