SUBSTRATE FOR MOUNTING ELEMENT, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a substrate for mounting an element with improved sulfide resistance by increasing flatness of a surface of a thick film conductor layer.SOLUTION: A substrate 10 for mounting an element has such a structure that a thick film conductor layer 2 which is a terminal for...

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Bibliographische Detailangaben
1. Verfasser:	NAKAYAMA KATSUHISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate for mounting an element with improved sulfide resistance by increasing flatness of a surface of a thick film conductor layer.SOLUTION: A substrate 10 for mounting an element has such a structure that a thick film conductor layer 2 which is a terminal for connecting the element is formed on the surface of a ceramic substrate 1. The thick film conductor layer 2 is made of metal mainly of Ag or Cu, and formed by printing and firing metallic paste. The surface of the thick film conductor layer 2 is flattened to surface roughness Ra of 0.02 μm or less by wet-blast treatment. A Ni/Au plating layer 3 is formed on the thick film conductor layer 2, and the surface of the thick film conductor layer 2 is completely covered without a clearance.