VACUUM DEPOSITION DEVICE
PROBLEM TO BE SOLVED: To provide a vacuum deposition device capable of stably forming a vapor deposition film with a uniform film thickness without blocking an orifice of an orifice plate while weakening the directivity of an evaporation material.SOLUTION: A vacuum deposition device includes: an eva...
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| creator | DAIKU HIROYUKI FUKUDA AKIO |
| description | PROBLEM TO BE SOLVED: To provide a vacuum deposition device capable of stably forming a vapor deposition film with a uniform film thickness without blocking an orifice of an orifice plate while weakening the directivity of an evaporation material.SOLUTION: A vacuum deposition device includes: an evaporation vessel for obtaining an evaporation material by heating a vapor deposition material; a diffusion vessel capable of diffusing the evaporation material obtained in the evaporation vessel; a discharge nozzle 32 provided in the diffusion vessel and discharging the evaporation material toward a substrate through an outlet 33; and a vapor deposition vessel in which the substrate is arranged and vapor deposition is performed under predetermined vacuum. The vacuum deposition device has an inner wall step 34 formed by expanding an inner diameter of the discharge nozzle 32 and facing the outlet 33, and further includes: an orifice plate 36 arranged on the inner wall step 34 and having an orifice 37 formed in the orifice plate, the orifice having a diameter smaller than the inner diameter of the discharge nozzle 32; and a C-shaped snap ring 38 arranged to hold the orifice plate 36 with the inner wall step 34. |
| format | Patent |
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The vacuum deposition device has an inner wall step 34 formed by expanding an inner diameter of the discharge nozzle 32 and facing the outlet 33, and further includes: an orifice plate 36 arranged on the inner wall step 34 and having an orifice 37 formed in the orifice plate, the orifice having a diameter smaller than the inner diameter of the discharge nozzle 32; and a C-shaped snap ring 38 arranged to hold the orifice plate 36 with the inner wall step 34.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120322&DB=EPODOC&CC=JP&NR=2012057235A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120322&DB=EPODOC&CC=JP&NR=2012057235A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DAIKU HIROYUKI</creatorcontrib><creatorcontrib>FUKUDA AKIO</creatorcontrib><title>VACUUM DEPOSITION DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a vacuum deposition device capable of stably forming a vapor deposition film with a uniform film thickness without blocking an orifice of an orifice plate while weakening the directivity of an evaporation material.SOLUTION: A vacuum deposition device includes: an evaporation vessel for obtaining an evaporation material by heating a vapor deposition material; a diffusion vessel capable of diffusing the evaporation material obtained in the evaporation vessel; a discharge nozzle 32 provided in the diffusion vessel and discharging the evaporation material toward a substrate through an outlet 33; and a vapor deposition vessel in which the substrate is arranged and vapor deposition is performed under predetermined vacuum. The vacuum deposition device has an inner wall step 34 formed by expanding an inner diameter of the discharge nozzle 32 and facing the outlet 33, and further includes: an orifice plate 36 arranged on the inner wall step 34 and having an orifice 37 formed in the orifice plate, the orifice having a diameter smaller than the inner diameter of the discharge nozzle 32; and a C-shaped snap ring 38 arranged to hold the orifice plate 36 with the inner wall step 34.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAIc3QODfVVcHEN8A_2DPH09wMywzydXXkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBoZGBqbmRsamjMVGKADbkICg</recordid><startdate>20120322</startdate><enddate>20120322</enddate><creator>DAIKU HIROYUKI</creator><creator>FUKUDA AKIO</creator><scope>EVB</scope></search><sort><creationdate>20120322</creationdate><title>VACUUM DEPOSITION DEVICE</title><author>DAIKU HIROYUKI ; FUKUDA AKIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2012057235A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>DAIKU HIROYUKI</creatorcontrib><creatorcontrib>FUKUDA AKIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DAIKU HIROYUKI</au><au>FUKUDA AKIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VACUUM DEPOSITION DEVICE</title><date>2012-03-22</date><risdate>2012</risdate><abstract>PROBLEM TO BE SOLVED: To provide a vacuum deposition device capable of stably forming a vapor deposition film with a uniform film thickness without blocking an orifice of an orifice plate while weakening the directivity of an evaporation material.SOLUTION: A vacuum deposition device includes: an evaporation vessel for obtaining an evaporation material by heating a vapor deposition material; a diffusion vessel capable of diffusing the evaporation material obtained in the evaporation vessel; a discharge nozzle 32 provided in the diffusion vessel and discharging the evaporation material toward a substrate through an outlet 33; and a vapor deposition vessel in which the substrate is arranged and vapor deposition is performed under predetermined vacuum. The vacuum deposition device has an inner wall step 34 formed by expanding an inner diameter of the discharge nozzle 32 and facing the outlet 33, and further includes: an orifice plate 36 arranged on the inner wall step 34 and having an orifice 37 formed in the orifice plate, the orifice having a diameter smaller than the inner diameter of the discharge nozzle 32; and a C-shaped snap ring 38 arranged to hold the orifice plate 36 with the inner wall step 34.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | VACUUM DEPOSITION DEVICE |
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