PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR MANUFACTURING RESIST PATTERN, METHOD FOR MANUFACTURING LEAD FRAME, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in photosensitivity, reliability of tenting property, adhesiveness and resolution, and to provide a photosensitive element, a method for manufacturing a resist pattern, a method for manufacturing a printed wiring board, a...

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Bibliographische Detailangaben
Hauptverfasser:	ISO JUNICHI, USUBA MANAMI, AJIOKA YOSHIKI, ISHI MITSURU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in photosensitivity, reliability of tenting property, adhesiveness and resolution, and to provide a photosensitive element, a method for manufacturing a resist pattern, a method for manufacturing a printed wiring board, a method for manufacturing a lead frame, and a printed wiring board.SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having at least one ethylenically unsaturated bond, (C) a photopolymerization initiator, and (D) a sensitized dye. The component (B) contains a (meth)acrylate compound having a skeleton derived from dipentaerythritol, and the component (D) contains a pyrazoline compound.