PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, METHOD FOR FORMING RIB PATTERN, METHOD FOR FORMING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent moisture heat resistance, exhibiting a high elastic modulus of a cured product at high temperature and excellent hollow structure retaining property, and to provide a photosensitive film, a method for forming a rib...
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| creator | KATO SADAAKI |
| description | PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent moisture heat resistance, exhibiting a high elastic modulus of a cured product at high temperature and excellent hollow structure retaining property, and to provide a photosensitive film, a method for forming a rib pattern, a method for forming a hollow structure, and an electronic component using the composition.SOLUTION: The photosensitive resin composition to be used for a rib material or a cap material having a hollow structure in an electronic component having the hollow structure contains (A) a heat-crosslinking compound, (B) a photopolymerizable compound having at least one ethylenically unsaturated group, and (C) a photopolymerization initiator. The content of the (A) heat-crosslinking compound is 10 to 40 parts by mass when the total amount of the (A) heat-crosslinking compound having condensation reactivity and the (B) photopolymerizable compound having at least one ethylenically unsaturated group is 100 parts by mass. A photosensitive film is obtained from the photosensitive resin composition. |
| format | Patent |
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The content of the (A) heat-crosslinking compound is 10 to 40 parts by mass when the total amount of the (A) heat-crosslinking compound having condensation reactivity and the (B) photopolymerizable compound having at least one ethylenically unsaturated group is 100 parts by mass. 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The content of the (A) heat-crosslinking compound is 10 to 40 parts by mass when the total amount of the (A) heat-crosslinking compound having condensation reactivity and the (B) photopolymerizable compound having at least one ethylenically unsaturated group is 100 parts by mass. 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The content of the (A) heat-crosslinking compound is 10 to 40 parts by mass when the total amount of the (A) heat-crosslinking compound having condensation reactivity and the (B) photopolymerizable compound having at least one ethylenically unsaturated group is 100 parts by mass. A photosensitive film is obtained from the photosensitive resin composition.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, METHOD FOR FORMING RIB PATTERN, METHOD FOR FORMING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT |
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