METHOD OF MANUFACTURING MULTI-UNIT WIRING SUBSTRATE
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multi-unit wiring substrate, which includes a product region where a plurality of wiring-substrate portions are arranged vertically and horizontally and a tab part which is arranged along the periphery of the product region, with the tab p...
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| creator | SUZUKI ATSUSHI MAEHARA SHINJI |
| description | PROBLEM TO BE SOLVED: To provide a method of manufacturing a multi-unit wiring substrate, which includes a product region where a plurality of wiring-substrate portions are arranged vertically and horizontally and a tab part which is arranged along the periphery of the product region, with the tab part causing no deflection.SOLUTION: The method of manufacturing a multi-unit wiring substrate includes a step for preparing a green sheet laminate that contains a product region P in which a plurality of ceramic green sheets s1-s3 are stacked, with a front surface 5 and a rear surface 6 having square shape in plan view provided and a plurality of wiring substrate portions p arranged vertically and horizontally, as well as a tab part M which is arranged along the periphery of the product region P, a step in which a division groove cg is formed along the periphery of the product region P in the tab part M of the green sheet laminate, and the tab part M is divided in a first tab part m1 on the side of product region P and a second tab part m2 positioned outside the first tab part m1, a step to form a ceramic laminate 7 by baking the green sheet laminate in which the division groove cg is formed, and a step for removing the second tab part m2 after baking from the ceramic laminate 7. |
| format | Patent |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | METHOD OF MANUFACTURING MULTI-UNIT WIRING SUBSTRATE |
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