PLANARIZED RESIN-COATED PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To manufacture, without requiring polishing, a planarized resin-coated printed circuit board having both surfaces planarized at an extremely high level, and having constant thickness over all regions of the printed circuit board, and having excellent component packaging stabili...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOGA YUKIHIRO, KITAMURA KAZUNORI, FUJITSU SHOJI, SATO KIYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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