RETICLE COOLING IN LITHOGRAPHY DEVICE
PROBLEM TO BE SOLVED: To provide a device and a method of reducing temperature variation over a reticle so that variation in expansion of the reticle is reduced.SOLUTION: One method of achieving reduced temperature variation is to fill the internal space with pressurized backfill gas by using a dist...
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| creator | SAMIA A NAYEF |
| description | PROBLEM TO BE SOLVED: To provide a device and a method of reducing temperature variation over a reticle so that variation in expansion of the reticle is reduced.SOLUTION: One method of achieving reduced temperature variation is to fill the internal space with pressurized backfill gas by using a distribution trench and wall (e.g. a flow restriction dam) rather than providing uniform backfill gas pressure over the entire reticle. In a different method, outer periphery of the internal space may be selected to reduce variation in expansion over the reticle based on the functional relation between expansion and temperature for a reticle material. In an arbitrary or alternative method, reduced variation in expansion over the reticle can be obtained by filling the cavity in a chuck cooled by fluid selectively with backfill gas. |
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In a different method, outer periphery of the internal space may be selected to reduce variation in expansion over the reticle based on the functional relation between expansion and temperature for a reticle material. 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In a different method, outer periphery of the internal space may be selected to reduce variation in expansion over the reticle based on the functional relation between expansion and temperature for a reticle material. 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In a different method, outer periphery of the internal space may be selected to reduce variation in expansion over the reticle based on the functional relation between expansion and temperature for a reticle material. In an arbitrary or alternative method, reduced variation in expansion over the reticle can be obtained by filling the cavity in a chuck cooled by fluid selectively with backfill gas.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
| title | RETICLE COOLING IN LITHOGRAPHY DEVICE |
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