PRINTED WIRING BOARD, MANUFACTURING METHOD OF PRINTED WIRING BOARD, AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To prevent a product from warping and twisting due to difference of thermal expansion coefficients.SOLUTION: A printed wiring board includes: a wiring through-hole part 5 that includes a wiring through hole 5A formed across the thickness of a surface part 2A of a base material...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: IIDA KENJI, MAEHARA YASUTOMO, YOSHIMURA HIDEAKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To prevent a product from warping and twisting due to difference of thermal expansion coefficients.SOLUTION: A printed wiring board includes: a wiring through-hole part 5 that includes a wiring through hole 5A formed across the thickness of a surface part 2A of a base material 2 and that uses an insulation material 6B having a thermal expansion coefficient different from the thermal expansion coefficient of the base material 2; and a heat expansion adjustment part 6 that includes a lower hole 6A formed in the surface part 2A of the base material 2 and that is formed by filling the lower hole 6A with the insulation material 6B. The heat expansion adjustment part 6 is arranged in cells 20, which are defined in the surface part 2A of the base material 2, in accordance with an arrangement location of the wiring through-hole part 5 in the cells 20 so that a difference of thermal expansion coefficients in vertical and horizontal directions in the cell 20 is minimum.