SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device effectively dispersing heat generated during the operation of a semiconductor element into a sealing member, improving a heat radiating property of the semiconductor device, and reducing heat resistance.SOLUTION: A semiconductor device comprise...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KAWAZU TAKESHI, IMAIZUMI YUKARI, KUDO ISAO, KATSUMATA AKIO, HIRUTA YOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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