SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To suppress occurrence of chip cracks in a semiconductor device in which a semiconductor chip including an SiC substrate is mounted on a mounting portion of Cu.SOLUTION: A semiconductor device 100 comprises: a semiconductor chip 10 including an SiC substrate 12; and a mounting...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	KAWAKUBO HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	KAWAKUBO HIROSHI
description	PROBLEM TO BE SOLVED: To suppress occurrence of chip cracks in a semiconductor device in which a semiconductor chip including an SiC substrate is mounted on a mounting portion of Cu.SOLUTION: A semiconductor device 100 comprises: a semiconductor chip 10 including an SiC substrate 12; and a mounting portion 20 made of Cu for mounting the semiconductor chip. The semiconductor chip 10 is bonded to the mounting portion 20 with an Ag paste 30 in which Ag fine particles are dispersed in a solution not containing epoxy. The Ag paste is softer than an AuSn paste and functions as a buffer material for relieving stress transferred from the mounting portion 20 of Cu to the semiconductor chip 10. Therefore, occurrence of chip cracks can be suppressed by using the Ag paste as a brazing material for fixing the semiconductor chip 10 to the mounting portion 20.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2012028613A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2012028613A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2012028613A3</originalsourceid><addsrcrecordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhkYGRhZmhsaOxkQpAgC8FR8Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>KAWAKUBO HIROSHI</creator><creatorcontrib>KAWAKUBO HIROSHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To suppress occurrence of chip cracks in a semiconductor device in which a semiconductor chip including an SiC substrate is mounted on a mounting portion of Cu.SOLUTION: A semiconductor device 100 comprises: a semiconductor chip 10 including an SiC substrate 12; and a mounting portion 20 made of Cu for mounting the semiconductor chip. The semiconductor chip 10 is bonded to the mounting portion 20 with an Ag paste 30 in which Ag fine particles are dispersed in a solution not containing epoxy. The Ag paste is softer than an AuSn paste and functions as a buffer material for relieving stress transferred from the mounting portion 20 of Cu to the semiconductor chip 10. Therefore, occurrence of chip cracks can be suppressed by using the Ag paste as a brazing material for fixing the semiconductor chip 10 to the mounting portion 20.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120209&DB=EPODOC&CC=JP&NR=2012028613A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120209&DB=EPODOC&CC=JP&NR=2012028613A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAWAKUBO HIROSHI</creatorcontrib><title>SEMICONDUCTOR DEVICE</title><description>PROBLEM TO BE SOLVED: To suppress occurrence of chip cracks in a semiconductor device in which a semiconductor chip including an SiC substrate is mounted on a mounting portion of Cu.SOLUTION: A semiconductor device 100 comprises: a semiconductor chip 10 including an SiC substrate 12; and a mounting portion 20 made of Cu for mounting the semiconductor chip. The semiconductor chip 10 is bonded to the mounting portion 20 with an Ag paste 30 in which Ag fine particles are dispersed in a solution not containing epoxy. The Ag paste is softer than an AuSn paste and functions as a buffer material for relieving stress transferred from the mounting portion 20 of Cu to the semiconductor chip 10. Therefore, occurrence of chip cracks can be suppressed by using the Ag paste as a brazing material for fixing the semiconductor chip 10 to the mounting portion 20.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhkYGRhZmhsaOxkQpAgC8FR8Q</recordid><startdate>20120209</startdate><enddate>20120209</enddate><creator>KAWAKUBO HIROSHI</creator><scope>EVB</scope></search><sort><creationdate>20120209</creationdate><title>SEMICONDUCTOR DEVICE</title><author>KAWAKUBO HIROSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2012028613A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KAWAKUBO HIROSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAWAKUBO HIROSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR DEVICE</title><date>2012-02-09</date><risdate>2012</risdate><abstract>PROBLEM TO BE SOLVED: To suppress occurrence of chip cracks in a semiconductor device in which a semiconductor chip including an SiC substrate is mounted on a mounting portion of Cu.SOLUTION: A semiconductor device 100 comprises: a semiconductor chip 10 including an SiC substrate 12; and a mounting portion 20 made of Cu for mounting the semiconductor chip. The semiconductor chip 10 is bonded to the mounting portion 20 with an Ag paste 30 in which Ag fine particles are dispersed in a solution not containing epoxy. The Ag paste is softer than an AuSn paste and functions as a buffer material for relieving stress transferred from the mounting portion 20 of Cu to the semiconductor chip 10. Therefore, occurrence of chip cracks can be suppressed by using the Ag paste as a brazing material for fixing the semiconductor chip 10 to the mounting portion 20.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_JP2012028613A
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	SEMICONDUCTOR DEVICE
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-16T21%3A55%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KAWAKUBO%20HIROSHI&rft.date=2012-02-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2012028613A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true