ELECTRONIC COMPONENT MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide an electronic component manufacturing method which make it possible to control the shape dimensions of an electrode paste after a blotting process within a desired range.SOLUTION: The electronic component manufacturing method stipulates, based on the thickness Sof an electrode paste P1 adhered to an end face 2a of an element assembly 2 and the thickness d of an electrode paste P2 adhered to a flat plate 10, a push-in amount S by which amount the electrode paste P1 on the end face 2a of the element assembly 2 is pushed in against the electrode paste P2 on the flat plate 10. This ensures that a B ascent and an H dimension will be confined within a desired range. Restriction of the B ascent makes it possible to suppress the occurrence of tombstoning when a multilayer ceramic capacitor 1 is mounted in place. Also, restriction of the H dimension makes it easy to confine the multilayer ceramic capacitor 1 within product standard dimensions.