SUBSTRATE HOLDER STOCKER DEVICE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE HOLDER MOVING METHOD USING THE SUBSTRATE HOLDER STOCKER DEVICE
PROBLEM TO BE SOLVED: To provide a substrate holder stocker device capable of reducing footprint.SOLUTION: A substrate holder stocker chamber 18 storing a substrate holder to be conveyed in a process chamber which performs a vacuum processing to a substrate comprises: a movable table A which holds a...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | TOSAKA TAKASHI SONE HIROSHI |
description | PROBLEM TO BE SOLVED: To provide a substrate holder stocker device capable of reducing footprint.SOLUTION: A substrate holder stocker chamber 18 storing a substrate holder to be conveyed in a process chamber which performs a vacuum processing to a substrate comprises: a movable table A which holds a plurality of substrate holders side by side in a plate thickness direction thereof and moves back and forth; a movable table B which is provided parallel to the movable table A and holds a plurality of the substrate holders side by side in a plate thickness direction thereof, and which moves back and forth; and an inter-table transfer mechanism 31 for allowing the substrate holder which is held by one of the movable tables A and B stopped at a predetermined positions to be held by the other of the movable tables A and B. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2012019116A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2012019116A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2012019116A3</originalsourceid><addsrcrecordid>eNrjZOgNDnUKDglyDHFV8PD3cXENUggO8Xf2BtIurmGezq46CggFAUH-zq7BwZ5-7gqOAQGOQLHQYB0FRz8XBQxDfP3DQMp8XUM8_F0UQsF6QjxcFQjYxsPAmpaYU5zKC6W5GZTcXEOcPXRTC_LjU4sLEpNT81JL4r0CjAwMgcjS0NDM0ZgoRQBgtUCL</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE HOLDER STOCKER DEVICE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE HOLDER MOVING METHOD USING THE SUBSTRATE HOLDER STOCKER DEVICE</title><source>esp@cenet</source><creator>TOSAKA TAKASHI ; SONE HIROSHI</creator><creatorcontrib>TOSAKA TAKASHI ; SONE HIROSHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a substrate holder stocker device capable of reducing footprint.SOLUTION: A substrate holder stocker chamber 18 storing a substrate holder to be conveyed in a process chamber which performs a vacuum processing to a substrate comprises: a movable table A which holds a plurality of substrate holders side by side in a plate thickness direction thereof and moves back and forth; a movable table B which is provided parallel to the movable table A and holds a plurality of the substrate holders side by side in a plate thickness direction thereof, and which moves back and forth; and an inter-table transfer mechanism 31 for allowing the substrate holder which is held by one of the movable tables A and B stopped at a predetermined positions to be held by the other of the movable tables A and B.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120126&DB=EPODOC&CC=JP&NR=2012019116A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120126&DB=EPODOC&CC=JP&NR=2012019116A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TOSAKA TAKASHI</creatorcontrib><creatorcontrib>SONE HIROSHI</creatorcontrib><title>SUBSTRATE HOLDER STOCKER DEVICE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE HOLDER MOVING METHOD USING THE SUBSTRATE HOLDER STOCKER DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a substrate holder stocker device capable of reducing footprint.SOLUTION: A substrate holder stocker chamber 18 storing a substrate holder to be conveyed in a process chamber which performs a vacuum processing to a substrate comprises: a movable table A which holds a plurality of substrate holders side by side in a plate thickness direction thereof and moves back and forth; a movable table B which is provided parallel to the movable table A and holds a plurality of the substrate holders side by side in a plate thickness direction thereof, and which moves back and forth; and an inter-table transfer mechanism 31 for allowing the substrate holder which is held by one of the movable tables A and B stopped at a predetermined positions to be held by the other of the movable tables A and B.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOgNDnUKDglyDHFV8PD3cXENUggO8Xf2BtIurmGezq46CggFAUH-zq7BwZ5-7gqOAQGOQLHQYB0FRz8XBQxDfP3DQMp8XUM8_F0UQsF6QjxcFQjYxsPAmpaYU5zKC6W5GZTcXEOcPXRTC_LjU4sLEpNT81JL4r0CjAwMgcjS0NDM0ZgoRQBgtUCL</recordid><startdate>20120126</startdate><enddate>20120126</enddate><creator>TOSAKA TAKASHI</creator><creator>SONE HIROSHI</creator><scope>EVB</scope></search><sort><creationdate>20120126</creationdate><title>SUBSTRATE HOLDER STOCKER DEVICE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE HOLDER MOVING METHOD USING THE SUBSTRATE HOLDER STOCKER DEVICE</title><author>TOSAKA TAKASHI ; SONE HIROSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2012019116A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>TOSAKA TAKASHI</creatorcontrib><creatorcontrib>SONE HIROSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TOSAKA TAKASHI</au><au>SONE HIROSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE HOLDER STOCKER DEVICE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE HOLDER MOVING METHOD USING THE SUBSTRATE HOLDER STOCKER DEVICE</title><date>2012-01-26</date><risdate>2012</risdate><abstract>PROBLEM TO BE SOLVED: To provide a substrate holder stocker device capable of reducing footprint.SOLUTION: A substrate holder stocker chamber 18 storing a substrate holder to be conveyed in a process chamber which performs a vacuum processing to a substrate comprises: a movable table A which holds a plurality of substrate holders side by side in a plate thickness direction thereof and moves back and forth; a movable table B which is provided parallel to the movable table A and holds a plurality of the substrate holders side by side in a plate thickness direction thereof, and which moves back and forth; and an inter-table transfer mechanism 31 for allowing the substrate holder which is held by one of the movable tables A and B stopped at a predetermined positions to be held by the other of the movable tables A and B.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_JP2012019116A |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | SUBSTRATE HOLDER STOCKER DEVICE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE HOLDER MOVING METHOD USING THE SUBSTRATE HOLDER STOCKER DEVICE |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T18%3A02%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TOSAKA%20TAKASHI&rft.date=2012-01-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2012019116A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |