FLEXIBLE PRINTED WIRING BOARD, CONNECTION STRUCTURE THEREOF, METHOD OF MANUFACTURING THEM, AND ELECTRONIC EQUIPMENT

FLEXIBLE PRINTED WIRING BOARD, CONNECTION STRUCTURE THEREOF, METHOD OF MANUFACTURING THEM, AND ELECTRONIC EQUIPMENT

PROBLEM TO BE SOLVED: To provide a flexible printed wiring board capable of avoiding stress concentration in the electrodes of the flexible printed wiring board even if it is deformed while efficiently and conductively connecting the electrodes each other using AFC.SOLUTION: A flexible wiring board...

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1. Verfasser: UCHIDA YOSHIFUMI
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator UCHIDA YOSHIFUMI
description PROBLEM TO BE SOLVED: To provide a flexible printed wiring board capable of avoiding stress concentration in the electrodes of the flexible printed wiring board even if it is deformed while efficiently and conductively connecting the electrodes each other using AFC.SOLUTION: A flexible wiring board 10 is covered with coverlay resin films 5 and 6 having electrodes 2a provided on their surfaces and leaving a space for an electrode connecting area S containing the electrodes so as to expose the electrodes. A wiring circuit 2b is located only on the back in a region overlapping the electrode connecting area in a plan view, and the electrodes on the surface are conductively connected to the wiring circuit on the back through a via hole h located in the electrode connecting area or the peripheral part thereof.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title FLEXIBLE PRINTED WIRING BOARD, CONNECTION STRUCTURE THEREOF, METHOD OF MANUFACTURING THEM, AND ELECTRONIC EQUIPMENT
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