MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING SAME

MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING SAME

PROBLEM TO BE SOLVED: To solve the problem that a resistance value of a via portion increases if the aperture of a via consisting of conductive paste is decreased, relating to a heat-resistant substrate that uses a conventional film.SOLUTION: A multilayer wiring board 11 at least includes a heat-res...

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Hauptverfasser: HONJO KAZUHIKO, HIGUCHI TOSHIHIRO, HIRAI SHOGO
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator HONJO KAZUHIKO
HIGUCHI TOSHIHIRO
HIRAI SHOGO
description PROBLEM TO BE SOLVED: To solve the problem that a resistance value of a via portion increases if the aperture of a via consisting of conductive paste is decreased, relating to a heat-resistant substrate that uses a conventional film.SOLUTION: A multilayer wiring board 11 at least includes a heat-resistant film 14 whose thickness is 30 μm or less, a wiring 12 fixed on both surfaces of the heat-resistant film 14 through an adhesive layer 13, a hole 23 formed on the heat-resistant film 14, and a conductive paste 21 which is packed in the hole 23 for interlayer connection with the wiring 12. Here, the diameters of the holes 23 differ each other by 10-100% on both surfaces of the heat-resistant film 14. The average thickness of the adhesion layer 13 is 3-25 μm. A ring-like bent part 16 is provided around the hole. Thus, increase in resistance value of the via portion is reduced.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING SAME
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